Quilt Packaging Patent

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Leslie Lestinsky | December 26, 2018

Indiana Integrated Circuits (IIC), a start-up company founded by University of Notre Dame, Department of Electrical Engineering (NDEE) faculty and alumni, has obtained its thirteenth patent–in addition to 12 pending United States and international patents–related to their Quilt Packaging technology. NDEE faculty researchers/inventors associated with IIC are Gary Bernstein, Patrick Fay and Wolfgang Porod, as well as  NDEE alumnus, Jason Kulick. This particular patent was a result of the joint efforts of NDEE professors Scott Howard, Doug Hall, Anthony Hoffman and Gary Bernstein.

Quilt Packaging is a revolutionary integrated circuit packaging concept that combines the functions of several individual components into a single “quilt”. This particular patent protects optical Quilt Packaging, which is used for chip-to-chip integration of photonic devices such as lasers, fiber optics, waveguides and photodetectors.

Kulick commented, “Our innovative microelectronics technology is game-changing for system performance. It enables ultra-wide bandwidths and ultra-low loss in heterogeneous integration with applications across a wide range of markets.” 

Potential fields of use for this Quilt Packaging patent include fiber optics for communication, high-throughput data links for cellular backhaul and high-performance computing, lidar for vehicle sensing in autonomous vehicles, and spectroscopy for chemical/biomedical detection. IIC works closely with companies specializing in defense systems, automotive power electronics, radio frequency/microwave systems, power conversion, sensors, and biomedical fields.

Read more here.

 by Daily Domer Staff

Posted In: Features